Automated Machines
Automated Machines
By taking use of the ultimate mechatronics technology, with the help of our strong point, the high-quality manufacturing, we offer an integrated support for development, design, manufacture and maintenance of power-saving automated equipments made to meet customer’s needs.
Based on our motto: “Respond to customers’ needs using our challenge spirit”, we manufacture for you highly reasonable revolutionary devices.
Electronic Parts
Lead Processing Systems
Outlines |
The machine feeds strip frames into the mold, processes the leads and deposits products into an exclusive magazine. Can also work with hoop-shape materials) |
Type |
LKJ |
Capacity |
0.45 sec/ 1 shot |
Dimensions of the machine |
W850mm×D1100mm×H1700mm |
Film-processing Equipment
Outlines |
Performs external diameter punching on 35- to 70-mm wide tub-tape, then stores products into a special tray. |
Type |
YST |
Capacity |
3sec/ piece |
Dimensions of the machine |
W1800mm×D750mm×H1700mm |
LED C/B System
Outlines |
Processes LED lead frames mounted on an especially-designed magazine, then stores products piece-by-piece. |
Type |
TLJ |
Capacity |
0.5sec/ 1 shot |
Dimensions of the machine |
W800mm×D700mm×H1950mm |
LED Tube Storing Equipment
Outlines |
Processes LED lead frames mounted on an especially-designed magazine, then stores products piece-by-piece. Piece-by-piece LED are tube-stored. * Storing can be adapted for tray or carrier tape. |
Type |
WUS |
Capacity |
0.6sec/ piece |
Dimensions of the machine |
W1400mm×D1100mm×H1700mm |
Carrier Tape Forming Equipment
Outlines |
It simultaneously feeds 2 reels of hoop-shape material into the spinning unit, processes them with a set of running dies, and then outputs the product on a spin-on reel. |
Type |
TLS |
Capacity |
1.3sec/ 8piece |
Dimensions of the machine |
W4000mm×D980mm×H2000mm |
Battery-related Field
Secondary Safety Valve Assembling Equipment For Batteries
Outlines |
This machine processes the material individually into parts and assembles safety valves for round-type secondary batteries. |
Type |
ZKL |
Capacity |
0.6sec/ piece |
Dimensions of the machine |
W1300mm×D1300mm×H1800mm |
In-car Products
Rectifying Element Lead C/B Equipment
Outlines |
This equipment processes rectifying elements mounted on an especially-designed magazine into a mold, sorts elements by element data, then stores products into a tray. |
Type |
EBS |
Capacity |
0.9sec/ piece |
Dimensions of the machine |
W1350mm×D1550mm×H1800mm |
Laser Frame Processing Equipment
Outlines |
This equipment processes laser frames mounted on an especially-designed magazine into a mold and stores products on a magazine especially designed for unloading. |
Type |
TLS |
Capacity |
1sec/ 1 shot |
Dimensions of the machine |
W1500mm×D1200mm×H1400mm |
Medical Products
Aluminium Foil Punching Equipment
Outlines |
This equipment punches and drops aluminium foil from a reel by a mold. Punched products are transferred by a conveyer and ejected by an absorption pad. |
Type |
WBS |
Capacity |
1sec/ 1 shot |
Dimensions of the machine |
W2200mm×D500mm×H1750mm |
Powder Processing
Servo One-way Forming Machine (Withdrawal-type) SSH-3000
Upper RAM press force |
Max3,000kgf |
Lower RAM push-out force |
Max1,500kgf |
Loading Depth |
Max30mm |
Upper ram stroke length |
Max70mm |
Upper ram positioning precision |
±0.02 |
Lower ram stroke length |
Max35mm |
Lower ram positioning precision |
±0.1 |
Under&Over Fill |
0~5mm |
Installation area |
850mm×850mm |
Weight |
Approx. 1,500kg |
Servo Two-way Forming Machine SYP-3000
Upper RAM press force |
Max3,000kgf |
Loading Depth |
30mm/ Die depth 35 mm |
Upper ram stroke length |
Max69mm |
Upper ram positioning precision |
±0.02 |
Lower ram stroke length |
Max30mm |
Lower ram positioning precision |
±0.02 |
Under&Over Fill |
0~10mm |
Installation area |
850mm×850mm |
Weight |
Approx. 1,500kg |
Powder Forming Equipment
Upper RAM press force |
Max3,000kgf |
Loading Depth |
30mm/ Die depth 35 mm |
Upper ram stroke length |
Max69mm |
Upper ram positioning precision |
±0.02 |
Lower ram stroke length |
Max30mm |
Lower ram positioning precision |
±0.02 |
Under&Over Fill |
0~10mm |
Distance and number of perturbations when loading |
Max. 2mm 10 times |
Installation area |
850mm×850mm |
Weight |
Approx. 1,500kg |
Semiconductor-related Field
LOC Tape Sticking Equipment
Outlines |
The equipment sticks on the lead-frame a tape used to further stick chips on it. |
Type |
YTP |
Capacity |
5sec/ 1 shot |
Dimensions of the machine |
W2100mm×D980mm×H1800mm |
Tape Punch Storing Equipment
Outlines |
It punches film fed from a reel by a progressive punch die. Punch products are stored in a tray. |
Type |
EBC |
Capacity |
2.5sec/2 piece |
Dimensions of the machine |
W1400mm×D700mm×H1900mm |
Other Fields
Protection Circuit Assembling Equipment
Outlines |
This equipment assembles a protection circuit part made to protect the main board against over current. |
Type |
ZKL |
Capacity |
0.6sec/ piece |
Dimensions of the machine |
W1300mm×D1300mm×H1800mm |